Die shot of the Power7+ chip from IBM
The Power7+ chip has a lot of new features to help accelerate specific functions inside of Power System boxes, including on-chip memory compression, encryption, and hashing algorithms, as well as a random-number generator that cannot be predicted because it is based on random electronic effects on the chip.
The Power7+ chip is implemented in a 32-nanometer process. Specifically, IBM's wafer bakery in East Fishkill, New York, uses a copper/silicon-on insulator process with high-k metal gates to etch the Power7+ chips, which have 2.1 billion transistors on the die.