|
|
||||||
|
||||||
|
||||||
|
|
||||||
|
Posted on 02/11/2013 11:45:03 AM PST by Ernest_at_the_Beach
(Excerpt) Read more at soitec.com ...
Fascinating details,...but very readable,
I found this by finding an article at Semi-Accurate,,,
GlobalFoundries Expands their IP Menu
See the last little note on ST-Micro....
Kinda interesting.
Benefits to the consumers,....faster SoCss and longer battery life for Smartphones and Tablets.
ST-Erickson has a smartphone with the SoC running at 2.5 Ghz.
http://www.stericsson.com/technologies/FD-SOI-eQuad-white-paper.pdf
***************************************************
Introduction
During the last few years the mobile platforms industry has aggressively introduced multiprocessing in response to the ever increasing performance demanded by the market. Given the highly competitive nature of the mobile industry, multiprocessing has been adopted as a marketing tool. This highly visible, differentiating feature is used to pass the oversimplified message that more processors mean better platforms and performance. The reality is much more complex, because several interdependent factors are at play in determining the efficiency of multiprocessing platforms (such as the effective impact on software performance, chip frequency, area and power consumption) with the number of processors impacting only partially the overall balance, and with contrasting effects linked to the underlying silicon technologies.
In this article we illustrate and compare the main technological options available in multiprocessing for mobile platforms, highlighting the synergies between multiprocessing and the disruptive FD-SOI silicon technology used in the upcoming ST-Ericsson products. We will show that compared to personal computers (PCs), the performance of single-processors in mobile platforms is still growing and how, from a software performance perspective, it is more profitable today to focus on faster dual-core rather than slower quad-core processors.
We will also demonstrate how FD-SOI benefits dual-core processors even more by providing higher frequency for the same power consumption, together with a wider range of energy efficient operating modes. All of this results in a simpler, cheaper and more effective solution than competing homogeneous and heterogeneous quad-processors.
It is important to recall that multiprocessors are a necessity, not a choice. Historically they have been introduced in mainstream products such as PCs, once frequency scaling reached the chips’ heat dissipation limits - not before. Indeed since the beginning of silicon integration up until 2003-2005, the scaling of frequency and of the number of transistors have been used in mainstream computing mostly for single-processor evolutions (illustrated in Figure 1). During this period, applications performance simply scaled at the same rate as the hardware evolution, without the need to make any change to the growing software legacy, producing the phenomenal growth in computing that we have enjoyed in the past.
Figure 1....Intel CPU Trends......see the PDF
************************************************************
Enough copying....
Nice.
ST-Erickson has a smartphone with the SoC running at 2.5 Ghz.
I hadn't heard that... 2.5 GHz.
That's a lot faster than the old Pentium 1's 60MHz; though I'll admit I'm much more of a software-guy.
Thanks E.. As time goes by some of this stuff gets a bit difficult to follow on the fly.
Under 10 minutes.
Mmmm...wafers. They’re fab.
Thanks Ernest.
http://www.soitec.com/en/index.php
****************************************
And a newsletter site:
Bookmark.
****************************************************
Common Platform Technology Forum 2013: SOI Highlights
Posted by Adele HARS on February 11, 2013 In Editor's Blog
Tagged with 14nm, 28nm, ARM, Cadence, FD-SOI, FinFET, GlobalFoundries, IBM, IBS, Photonics, R&D, rf, silicon-on-insulator, ST
The 2013 Common Platform Technology Forum showcased “the latest technological advances being delivered to the world’s leading electronics companies,” so of course SOI-based topics were well-represented. Happily, those of us who weren’t able to get over to Silicon Valley were able to attend “virtually” via a live stream (which is now reposted – click here …
LINK to full Paper:
Common Platform Technology Forum 2013: SOI Highlights
***********************************EXCERPT********************************
Here’s a round-up of the SOI-based highlights.
Soitec is the world leader in generating and manufacturing revolutionary semiconductor materials for electronic and energy industries. As an industrial company, we have built our reputation developing and manufacturing our flagship material, SOI (Silicon-on-Insulator).
Jean-Michel Lamure and André-Jacques Auberton-Hervé founded Soitec in 1992 to develop and commercialize the revolutionary Smart Cut™ “atomic scalpel” technology. Since then, the company has continued to innovate and grow. Today we are leading technological advances that will shape the performance of tomorrow’s products on markets like computing, telecommunications, automotive electronics, and lighting. Our Concentrix™ technology has also enabled us to become a global leader in the manufacture of systems used by the concentrator photovoltaic (CPV) solar energy industry.
Soitec is a truly international company, with:
Soitec leverages a strong portfolio of technologies and a high capacity for innovation to deliver enhanced performance and energy efficiency to the electronics and energy markets – some of tomorrow’s biggest challenges.
10/11/2012
October 11, 2012 - Soitec and Shin-Etsu Handotai (SEH) have extended their cooperation in Soitec's Smart Cut technology with an extended 10-year licensing agreement, including a new level of joint technology cooperation, to facilitate development and wafer supply of silicon-on-insulator (SOI) wafers.
Under the agreement, Soitec and SEH will cross-license Smart Cut-related patents. SEH will continue to use Soitec's technology to manufacture SOI wafers, and now will extend the technology to other "silicon-on-anything" materials and address a broader range of applications. (SOA is defined as any material on top of which is a thin film of plain silicon.) Soitec and Sumitomo Electric, for example, have been working to develop gallium nitride (GaN) engineered substrates for LEDs, using the Smart Cut method.
The Smart Cut wafer bonding/layer-splitting technology was developed by Michel Bruel at CEA-Leti in 1991 and spun out into Soitec in 1992. A pilot line was created in 1996, and SEH was the first company to license the technology a year later. "We have worked side by side with SEH for more than 15 years, and together we have established Smart Cut as the industry standard for manufacturing SOI," stated Paul Boudre, COO of Soitec. With an increasing need to develop new materials that can extend performance and energy efficiency for today's (and tomorrow's) electronics devices, "we look forward to manufacturing new products such as planar FD-SOI and SOI for FinFETs."
"We are very excited about the business opportunities for SOI products, and we look forward to working with Soitec to extend the global supply chain for new products, such as FD-SOI and SOI for FinFETs, which are showing potential benefits in mobile and embedded applications," stated Nobuo Katsuoka, SEH director, SOI process engineering department.
***************************************EXCERPT***************************************
As the world's leading silicon wafer (a key substrate for integrated circuits) manufacturer, the Shin-Etsu Group continues to run at the leading edge of high-flatness and larger diameters in its wafer products. It has met early success with strong sales of its cutting-edge 300mm-diameter wafers and SOI wafers. It is steadily supplying these high-quality products to its worldwide customers.
********************************************
SOI (Silicon On Insulator) wafers
SOI wafers, with the structure having insulated oxide film under active silicon layer, are promising semiconductor material for leading edge devices such as high speed and low power consumption LSI, smart sensors, smart power devices and MEMS.
Disclaimer: Opinions posted on Free Republic are those of the individual posters and do not necessarily represent the opinion of Free Republic or its management. All materials posted herein are protected by copyright law and the exemption for fair use of copyrighted works.