[BiteYourSelf]

That’s some big chips.😳

[Yo-Yo]

That’s some big chips.😳

300-mm - is that 300 square mm in area, as in a 17mmx17mm die?

[sasquatch]

Started at 1 1/4 inch, ended at 200 mm (IBM w/notch)

[lefty-lie-spy]

Jinx. I’m your friend, bro.

[FarCenter]

300 mm is the diameter of the silicon wafer. After lithography and other processing steps, the wafer is cut into the individual chips. The chips are then tested and bonded into packaging suitable for mounting on circuit boards. These latter steps are usually done in Southeast Asia, even for wafers from fabs in the US and Europe.

[fretzer]

~12” wafers.

[Flying Circus]

300mm diameter wafer. The wafer can have anywhere from a handful to thousands of chips in it, depending on how big the chips are. After all the buildup processing is done they will cut it up for the individual elements. The wafer fab I worked in crammed up to 40,000 elements on a 150mm wafer.