IBM uses self-assembling material in chip advance

Reuters ^ | 5-3-2007 | Scott Hillis

[bedolido]

SAN FRANCISCO (Reuters) - IBM has developed a way to make microchips run up to one-third faster or use 15 percent less power by using an exotic material that "self-assembles" in a similar way to a seashell or snowflake.

The computer services and technology company said the new process allows the wiring on a chip to be insulated with vacuum, replacing the glass-like substances used for decades but which have become less effective as chips steadily shrink.

A cross section of a microprocessor shows empty space in between the chip's copper wiring in this undated handout photograph. REUTERS/IBM/Handout

[Ernest_at_the_Beach]

neat stuff!

[Ernest_at_the_Beach]

BBC Report:

Snowflakes promise faster chips

[SunkenCiv]

I’m sure this isn’t important. ;’)